MI Technovation Bhd
🇲🇾XKLS.5286MalaysiaTechnology
PriceMYR 5.810.00 (0%)
Latest anomalies
Neutral 10 detected in the last 120 days
- High: 2
- Medium: 3
- Low: 4
52-week high: the price is trading close to this level
52-week high: the price is trading close to this level
Realized volatility: a breakout above its trailing average
Daily return: an extreme move up, far outside its trailing 60-day range
Volume: a spike above the 20-day average
Free with a Finzer account.
Profile
- Technology
- Semiconductor Equipment & Materials
- Malaysia
Identity
- Exchange
- Bursa Malaysia . XKLS
- Type
- Stock
- ISIN
- MYL5286OO009
- CUSIP
- Not reported
Company
- Employees
- 0
- Headquarters
- Bayan Lepas, Malaysia
- Website
- https://mi-technovation.com
Market
- Shares outstanding
- 898.3M
- Market cap
- MYR 5.17B
Highlights
- Market cap
- MYR 5.17B
- EPS LTM
- MYR 0.05
- P/E LTM
- 110.34calculatedCalculated by Finzer, not reported by the data provider.
- Div yield
- 1.04%calculatedCalculated by Finzer, not reported by the data provider.
Fundamentals (LTM)
- Revenue
- MYR 502.82M+17.11%up year on year
- Net income
- MYR 46.86M-41.68%down year on year
- Gross margin
- 23.82%+80.95%up year on year
- Free cash flow
- MYR 1.33M-97.82%down year on year
Latest news
News is not sourced for this exchange.
Business summary
MI Technovation Bhd is a company in the technology sector, listed on Bursa Malaysia (Malaysia) under the ticker 5286. Its market capitalisation is MYR 5.17B, from 898.3M shares outstanding, as of . Across the 244 trading sessions to the shares traded between MYR 2.32 and MYR 6.47, and the last close of MYR 5.81 sits 84% of the way up that range. The company is headquartered in Bayan Lepas, Malaysia.
Mi Technovation Berhad, an investment holding company, engages in the design, development, manufacturing, and sales of semiconductor manufacturing equipment in Southeast Asia, Northeast Asia, and North America. It operates through Semiconductor Equipment Business Unit, Semiconductor Material Business Unit, and Semiconductor Solutions Business Unit, and Others segments. The Semiconductor Equipment Business Unit segment offers assembly and packaging, vision inspection, laser assisted bonding, and power and final test equipment; provides maintenance services and technical support for the machines; and sells associated spare parts and components. The Semiconductor Material Business Unit segment provides solder spheres in various forms, such as small, ultra small, ultralow alpha solder, and copper core solder balls used in ball grid array and wafer level packaging in the semiconductor industry. The Semiconductor Solutions Business Unit segment offers high power modules and devices for wide bandgap applications in automotive and renewable energy sectors. It also involved in design, development, manufacture, and sale of wafer level chip scale packaging sorting and precision bonding machines; provision of management services; and research and development, manufacture, sale, and marketing of specific process and application in assembly and packaging solutions to customers. The company was formerly known as Mi Equipment Holdings Berhad and changed its name to Mi Technovation Berhad in December 2018. Mi Technovation Berhad was founded in 2007 and is headquartered in Bayan Lepas, Malaysia.